Shanghai Wonsung Alloy Material Co., Ltd., located in Shanghai, China, is a high-tech enterprise specializing in the R&D, production, and sales of bonding wires for electronic packaging. Our product range includes copper, silver alloy, palladium-coated copper, gold-palladium-coated copper, gold-plated silver, aluminum, thick copper, and gold wires for IC and discrete device packaging. With automated Japanese and Korean production lines and advanced testing equipment, we deliver customized solutions, technical support, and comprehensive after-sales service.