Gold and Gold Alloy Bonding Wires
Gold Bonding wire is a thin wire made of pure gold. It is used to connect the chip inside an electronic device to the rest of the circuit. Because it is pure gold, it conducts electricity very well, is strong but flexible, and works reliably in heat and moisture. It is mainly used in making computer chips, LED lights, and other electronic parts.
描述
WS-G01: Excellent second-bond adhesion, well-formed ball shape, and soft FAB ball; suitable for QFN, QFP, and BGA packages.
WS-G02: High tensile strength and superior loop stability, well-suited for various BGA loop profiles, with excellent bump performance in stacked applications; applicable to long/short loops, stacking, and planar ICs.
WS-G03: Ultra-low loop height with minimal risk of neck damage; designed for low-loop applications, planar ICs, COB, and thin-frame packages.
WS-G04: High resistance to ball deformation during bonding; specifically developed for fine-pitch bonding applications.